![]() ![]() This clarity is more important than ever with the launch of Intel Foundry Services. Today, Intel introduced a new naming structure for its process nodes, creating a clear and consistent framework to give customers a more accurate view of process nodes across the industry. The industry has long recognized that traditional nanometer-based process node naming stopped matching the actual gate-length metric in 1997. More: Process & Packaging Innovations (Press Kit) | “Intel Accelerated” Webcast (Event Livestream/Replay) | Accelerating Process Innovation (Fact Sheet) | Accelerating Process Innovation (Quotes) | Intel Introduces New RibbonFET and PowerVia Technologies (Video) | Intel EMIB Technology Explained (Video) | Intel Foveros Technology Explained (Video) Until the periodic table is exhausted, we will be relentless in our pursuit of Moore’s Law and our path to innovate with the magic of silicon.” “We are leveraging our unparalleled pipeline of innovation to deliver technology advances from the transistor up to the system level. ![]() “Building on Intel’s unquestioned leadership in advanced packaging, we are accelerating our innovation roadmap to ensure we are on a clear path to process performance leadership by 2025,” Intel CEO Pat Gelsinger said during the global “ Intel Accelerated” webcast. Intel is positioned to receive the first High NA EUV production tool in the industry. In addition to announcing RibbonFET, its first new transistor architecture in more than a decade, and PowerVia, an industry-first new backside power delivery method, the company highlighted its planned swift adoption of next-generation extreme ultraviolet lithography (EUV), referred to as High Numerical Aperture (High NA) EUV. SANTA CLARA, Calif., J– Intel Corporation today revealed one of the most detailed process and packaging technology roadmaps the company has ever provided, showcasing a series of foundational innovations that will power products through 2025 and beyond. ![]() Strong momentum for Intel Foundry Services (IFS) with first customer announcements.New node naming to create consistent framework, more accurate view of process nodes for customers and the industry as Intel enters the angstrom era of semiconductors.Continued leadership in advanced 3D packaging innovations with Foveros Omni and Foveros Direct.Two breakthrough process technologies: RibbonFET, Intel’s first new transistor architecture in more than a decade, and PowerVia, an industry-first for backside power delivery.Roadmap of process and packaging innovations to power next wave of products through 2025 and beyond.Compare Standard and Premium Digital here.Īny changes made can be done at any time and will become effective at the end of the trial period, allowing you to retain full access for 4 weeks, even if you downgrade or cancel. You may also opt to downgrade to Standard Digital, a robust journalistic offering that fulfils many user’s needs. If you’d like to retain your premium access and save 20%, you can opt to pay annually at the end of the trial. If you do nothing, you will be auto-enrolled in our premium digital monthly subscription plan and retain complete access for $69 per month.įor cost savings, you can change your plan at any time online in the “Settings & Account” section. For a full comparison of Standard and Premium Digital, click here.Ĭhange the plan you will roll onto at any time during your trial by visiting the “Settings & Account” section. Premium Digital includes access to our premier business column, Lex, as well as 15 curated newsletters covering key business themes with original, in-depth reporting. Standard Digital includes access to a wealth of global news, analysis and expert opinion. ![]() During your trial you will have complete digital access to FT.com with everything in both of our Standard Digital and Premium Digital packages. ![]()
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